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DC Magnetron Sputtering Principles Sputtering is a physical vapor deposition process used to deposit a film of atoms onto a substrate. ... Let the roughing pump work on the foreline pressure to reduce it. 3. Close the foreline and THEN quickly open the roughing line. 4. Let the roughing pump work on the roughing line to reduce the pressure there. erating principles and characteristics of these devices as well as several typical applications. INTRODUCTION Hollow cathode sputtering sources, invented in the 1970s, are magnetrons which sputter material from the inside sur-faces of cylindrical targets [1,2]. Figure 1 shows a schematic representation of such a device. Because of their enclosed.

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